Infineon Technologies AG of Munich, Germany has introduced a new CoolSiC technology: the CoolSiC MOSFET 1200V M1H. The silicon carbide (SiC) chip will be implemented in a widely extended portfolio using the Easy module family, along with discrete packages using .XT interconnect technology. The M1H chip offers high flexibility and is suitable for solar energy systems, such as inverters, that have to meet peak demand. The chip is also suitable for applications such as fast electric vehicle (EV) charging, energy storage systems and other industrial applications...
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