Cadence’s Udaya Shankar explores the major shifts shaping the transformation of modern semiconductor design, from transistor architecture evolution and manufacturing complexity to chiplet-based design, UCIe standardization, and high-bandwidth memory. In a podcast, Siemens’ Tova Levy chats with Sudarshan Deo about what AI can do in 3D-IC design today, such as narrowing design space exploration in chiplet partitioning and floor planning, identifying promising materials and process combinations, or flagging reliability risks like thermal cycling and stress. Synopsys’ Sudeep Shivalli highlights stronger government support, expanding startup activity, greater access to capital, and a growing focus on ownership as key trends boosting India’s semiconductor sector. Keysight’s Jessy Cavazos looks ahead as progress continues on shaping a roadmap for 6G technologies, including the introduction of AI-native networking, integrated sensing and communication, and deeper integration of terrestrial and non-terrestrial networks. Arm’s John French walks through how to find and fix hidden graphics performance problems in mobile games, starting with an understanding of the strengths and weaknesses of mobile GPUs. SEMI’s Mayura Padmanabhan chats with Ilya Zabelinsky of International SubFab Research Labs about the growing importance of subfab infrastructure, the industry’s biggest challenges, and opportunities for collaboration, sustainability, and standards development. Plus, check out the blogs featured in the latest Systems & Design newsletter: Technology editor Brian Bailey suggests that instead of working out how to replace junior engineers with AI, companies develop better ways to train and build fresh minds with new ideas. Keysight’s Daren McClearnon explores how to build capability without forcing a disruptive rebuild of workflows. Arteris’ Ashley Stevens breaks down how to reduce the software required to coordinate increasingly complex systems. Axiomise’s Ashish Darbari, Nicky Khodadad, and Nguyen Vu explain how to find bugs that constrained-random simulation and model-heavy equivalence flows cannot. ChipAgents’ Kexun Zhang observes that engineers using agents suddenly inherit traditionally managerial responsibilities. Siemens EDA’s Keith Felton and Todd Burkholder define why effective substrate implementation is crucial for signal integrity, power delivery, and overall system reliability. Synopsys’ Urmimala Roy, Xi-Wei Lin, and Ravi Todi dig into why backside power delivery and design technology co-optimization help enable the full potential of new transistor structures. Cadence’s Jakob Engblom imagines brewing up different functionality without changing the underlying hardware. The post Blog Review: Sept. 2 appeared first on Semiconductor Engineering.
Source: https://semiengineering.com/blog-review-sept-2-4/