Marktech Optoelectronics Inc of Latham, NY, USA and its device manufacturing partner Optrans Corp of Kawasaki-Shi, Japan are introducing new transfer-molded photodiode and LED packaging capabilities, which are currently under development and scheduled for first customer availability in second-quarter 2026. The next-generation photonics packages offer improved reliability, optical beam control, enhanced environmental robustness, and reduced stray-light interference while supporting both conventional LED emitters and advanced point-source resonant-cavity light-emitting diode (RCLED) and quantum well light-emitting diode (QWLED) architectures...
Source: https://www.semiconductor-today.com/new ... 0126.shtml