In partnership with equipment provider Advanced Semiconductor Materials Lithography (ASML) of Veldhoven, The Netherlands and foundry Taiwan Semiconductor Manufacturing Corp (TSMC), nanoelectronics research center imec of Leuven, Belgium has presented a novel, robust and scalable 300mm integration route for 2D-material-based nFETs and pFETs at the 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits in Honolulu, Hawaii, USA (14–18 June)...
Source: https://www.semiconductor-today.com/new ... 0626.shtml