SE Chip Industry Technical Paper Roundup: Aug. 18

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SE Chip Industry Technical Paper Roundup: Aug. 18

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New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations ReVolt: Power Delivery Network-Aware Voltage Droop Control for 2.5D PIM Chiplet Architectures Washington State University, University of Wisconsin–Madison SCALE: Self-Supervised Constraint-Aware Layout GEneration for Local P&R DRV Fixing at Advanced Nodes NVIDIA, Duke University Are Gate-All-Around 2D CFETs the Optimal Architecture for the A2 Node and Beyond? imec From Lithography to Nanoimprint: Physics-Based, Data-Driven, and Hybrid Frameworks for Defect Prediction in Advanced Patterning Technologies National Taiwan University Innovative FA Hardware Solution to Enable System-Level Debug of 3D ICs Google, Delft University of Technology FAPlace: Joint Optimization of Chiplet Placement and Interposer Footprint for 2.5D Systems A*STAR Self-Focusing Control for Depth-Precise Wafer Slicing of 4H-SiC in Femtosecond Laser Processing Texas A&M University, KIMM, UST Image Find more semiconductor research papers here. The post Chip Industry Technical Paper Roundup: Aug. 18 appeared first on Semiconductor Engineering.

Source: https://semiengineering.com/chip-indust ... up-aug-18/
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