Researchers from University of California, Los Angeles published a technical paper titled “An Open-Source Benchmark Suite of 3D-IC Testcases.” Abstract Excerpt: The paper presents an “open-source suite of 3D-IC benchmark testcases” and provides “reusable virtual chiplet models covering compute, memory, I/O, analog, and substrate components.” Find the technical paper here. August 2026. Soni, Rohan, Jooyeon Jeong, Alexander Graening, Anthony Foo, Richard Chen, and Puneet Gupta. “An Open-Source Benchmark Suite of 3D-IC Testcases.” arXiv, August 2026. https://doi.org/10.48550/arXiv.2608.25155. The post Open-Source Benchmark Suite For 2.5D/3D Heterogeneous Integration Research in Physical Design (UCLA) appeared first on Semiconductor Engineering.
Source: https://semiengineering.com/open-source ... sign-ucla/