Find more semiconductor research papers here. The post Chip Industry Technical Paper Roundup: Sep. 1 appeared first on Semiconductor Engineering. Source: https://semiengineering.com/chip-indust ... dup-sep-1/
SE Chip Industry Technical Paper Roundup: Sep. 1
SE Chip Industry Technical Paper Roundup: Sep. 1
New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Thermal Tuning Overhead in Wafer-Scale Optical Interconnects for LLM MoE Training: A Cross-Layer Analysis and Ferroelectric-Based Mitigation Georgia Tech ROBBIN: Rowhammer-Based Backdoor Injection during Inference Northeastern University An Open-Source Benchmark Suite of 3D-IC Testcases UCLA Generative Design of Liquid-Cooling Channels for Thermal Management of 2.5D and 3D Integrated Advanced Packaging University of Michigan-Dearborn Homo-metal-element Mediated Surface Modification of Sapphire for Robust Epitaxy of Wafer-Scale Single-Crystalline 2D Semiconductors Peking University, ShanghaiTech University, Chinese Academy of Sciences et al. Deep Learning to Automate Parameter Extraction and Model Fitting of Two-Dimensional Transistors Stanford University, SLAC PPAPlace: Differentiable Cross-Stage Objectives for Chip Placement Optimization University of Alberta Find more semiconductor research papers here. The post Chip Industry Technical Paper Roundup: Sep. 1 appeared first on Semiconductor Engineering.
Source: https://semiengineering.com/chip-indust ... dup-sep-1/
Find more semiconductor research papers here. The post Chip Industry Technical Paper Roundup: Sep. 1 appeared first on Semiconductor Engineering. Source: https://semiengineering.com/chip-indust ... dup-sep-1/