At the 2024 International Conference on Silicon Carbide and Related Materials (ICSCRM) in Raleigh, NC, USA (29 September-4 October), ASM International N.V. of Almere, the Netherlands, which designs and manufactures semiconductor wafer processing equipment and process solutions, has introduced the dual-chamber PE2O8 silicon carbide (SiC) epitaxy system. Designed to address the needs of the SiC power device segment, the PE2O8 is claimed to be the benchmark epitaxy system for low defectivity and high process uniformity, all with the higher throughput and low cost of ownership needed to enable broader adoption of SiC devices...
Source: https://www.semiconductor-today.com/new ... 0924.shtml