NXP Semiconductors N.V. of Eindhoven, The Netherlands has launched a family of top-side-cooled RF amplifier modules, based on a packaging innovation designed to enable thinner and lighter radios for 5G infrastructure. These smaller base stations can be more easily and cost-effectively installed, and blend more discretely into their environment. NXP’s GaN multi-chip module series, combined with the industry’s first top-side-cooling solution for RF power, helps to reduce not only the thickness and weight of the radio by more than 20% but also the carbon footprint for the manufacture and deployment of 5G base stations...
Source: https://www.semiconductor-today.com/new ... 0623.shtml