Fabless firm Cambridge GaN Devices Ltd (CGD) — which was spun out of the University of Cambridge in 2016 to design, develop and commercialize power transistors and ICs that use GaN-on-silicon substrates — has announced two new packages for its ICeGaN family of GaN power ICs that offer enhanced thermal performance and simplify inspection. As variants of the well-proven DFN style, both packages are said to be extremely rugged and reliable...
Source: https://www.semiconductor-today.com/new ... 0624.shtml