ASMPT Ltd says that its new high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where optical and electronic components are integrated in a common housing. With what is claimed to be exceptional process stability and a placement accuracy of ±0.2μm @ 3σ, the bonding system is equipped for the communication technology of the future...
Source: https://www.semiconductor-today.com/new ... 1124.shtml