Discrete device designer and manufacturer Nexperia of Nijmegen, the Netherlands (which operates wafer fabs in Hamburg, Germany, and Hazel Grove Manchester, UK) has introduced a range of highly efficient and robust industrial-grade 1200V silicon carbide (SiC) MOSFETs with what is claimed to be industry-leading temperature stability in innovative X.PAK surface-mount (SMD) top-side-cooled packaging technology. With its compact form factor of 14mm x 18.5mm, the package combines the assembly benefits of SMD with the cooling efficiency of through-hole technology, ensuring optimal heat dissipation...
Source: https://www.semiconductor-today.com/new ... 0325.shtml