SCT NHanced supporting mixed-material heterogeneous hybrid bonding production with copper or nickel bonds
Posted: Wed Dec 17, 2025 10:48 am
NHanced Semiconductors Inc of Batavia, IL (the first US-based pure-play advanced packaging foundry) says that it uniquely supports mixed-material hybrid bonding with either copper or nickel bonds. Its new Besi bonding system further expands its advanced packaging yield and throughput...
Source: https://www.semiconductor-today.com/new ... 1225.shtml
Source: https://www.semiconductor-today.com/new ... 1225.shtml