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Researchers from University of Houston, Toyota, and Imperial College London published a technical paper titled “Deployable 3D Architectures from Wafer-Fabricated Precursors.” The paper shows that “standard wafer fabrication can produce free-standing, mechanically stable, doubly-curved 3D structures with prescribed Gaussian curvature — a capability not previously achieved through semiconductor manufacturing” and points toward “realizable 3D semiconductor devices.” Find the technical paper here. July 2026. Wang, Y., Shum, K., Song, Y. et al. Deployable 3D architectures from wafer-fabricated precursors. Nat Commun (2026). https://doi.org/10.1038/s41467-026-76052-y. Creative commons license.   The post Deployable 3D Structures from Wafer-Fabricated Precursors (U. of Houston, Toyota, Imperial College London) appeared first on Semiconductor Engineering.

Source: https://semiengineering.com/deployable- ... ge-london/