SE Chip Industry Technical Paper Roundup: Sept. 8

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SE Chip Industry Technical Paper Roundup: Sept. 8

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New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations FLINT: Efficiently Leveraging High Bandwidth Flash for Capacity-Scalable LLM Inference Acceleration Image Huawei, ETH Zürich, HUST A Process-Aware Hybrid Si/IGO Monolithic-3D 6T SRAM with BEOL Pass-Gates for the 2nm Node Image Georgia Tech, Synopsys Architecting the Next Generation of Asynchronous, Distributed GPUs for the AI Era Image Purdue University Hardware-Managed Heterogeneous High-Bandwidth Memory and Flash in LLM Inference Systems Image University of Oxford Intrinsic polarization superjunctions in III-nitride heterostructures for efficient power electronics Image EPFL Intracavity Laser Wavelength Tuning by a Programmable Forward-Only Silicon Photonics Interferometer Mesh Image UiT, Stanford University The influence of implantation conditions on dopant activation in Al-implanted 4H-SiC: A MD study applying an Al potential fitted to DFT barriers Image TU Wien, Silvaco Europe Image Find more semiconductor research papers here.       The post Chip Industry Technical Paper Roundup: Sept. 8 appeared first on Semiconductor Engineering.

Source: https://semiengineering.com/chip-indust ... -sept-8-2/
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