chipx.cam

After announcing its plasma alternative to chemical-mechanical planarization (CMP), Oxford Instruments Plasma Technology (OIPT) of Yatton, near Bristol, UK says that its non-contact plasma etch method of preparing silicon carbide substrates for epitaxy delivers comparable results to CMP but with lower operating expenditure (OPEX), higher device yield and a process window capable of supporting the transition to thinner wafers and therefore increasing wafers per boule...

Source: https://www.semiconductor-today.com/new ... 0922.shtml