With the exponential growth of AI computing needs, challenges arise in performance and energy efficiency across computing, memory, power supply and the interconnections linking them. STMicroelectronics of Geneva, Switzerland says that it is helping hyperscalers, and the leading optical module provider, to overcome these challenges by unveiling its next generation of proprietary technologies for higher-performing optical interconnect in data centers and AI clusters. Its new silicon photonics and next-gen BiCMOS technologies are scheduled to ramp up from second-half 2025 for 800Gb/s and 1.6Tb/s optical modules...
Source: https://www.semiconductor-today.com/new ... 0225.shtml