Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA has launched its bondable diamond solutions for thermal management: a diamond solution engineered with a specialized surface finish that enables direct bonding to semiconductor die for electronic and opto-electronic applications. By eliminating or dramatically reducing thermal interface resistance, bondable diamond significantly improves device cooling performance...
Source: https://www.semiconductor-today.com/new ... 0126.shtml