SE Chip Industry Technical Paper Roundup: Sept. 14

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SE Chip Industry Technical Paper Roundup: Sept. 14

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New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations CHIPSMORE: Compute-in-Interconnect and -Memory Chiplets for Multi-Mode Multi-Request LLM Inference Acceleration Image National University of Singapore REACH: Controller-Managed Long-Span ECC for HBM AI Inference Image RPI, IBM T. J. Watson Research Center High contrast EUV imaging enabled by topological quasi phase-only masks Image NYCU, TSMC Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging Image NIST, UC San Diego, et al. Efficient Hardware Information-Flow Tracking for Pre-Silicon Security Testing Image Princeton University, MIT CSAIL, EPFL Dissecting the transition metal dichalcogenides-based metal-oxide-semiconductor structures charge components Image imec, KU Leuven, ASM Image Find more semiconductor research papers here.   The post Chip Industry Technical Paper Roundup: Sept. 14 appeared first on Semiconductor Engineering.

Source: https://semiengineering.com/chip-indust ... p-sept-14/
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