Automated test solutions provider Teradyne Inc of North Reading, MA, USA has partnered with photonics assembly & test equipment provider ficonTEC Service GmbH of Achim, Germany to announce the availability of what is said to be the first high-volume, double-sided wafer probe test cell for silicon photonics. The solution is designed to meet the growing demand for high-throughput electro-optical testing of silicon photonic wafers driven by co-packaged optics (CPO) applications...
Source: https://www.semiconductor-today.com/new ... 0425.shtml