Photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated III-V lasers, modulators, amplifiers and detectors) says that, at the 15th International Symposium on Photonics and Electronics Convergence (ISPEC 2025) at Institute of Science Tokyo (17-18 November), its principal engineer and photonic integrated circuit (PIC) design expert Dr Molly Piels is giving a presentation on the latest advances in the heterogeneous integration of silicon and III-V materials and highlighting how they can be used to enable the fabrication of photonic components at scale. This includes a case study of the OpenLight Photonics Development Kit (PDK) that is helping to underpin growth in photonic IC manufacturing...
Source: https://www.semiconductor-today.com/new ... 1125.shtml