There has been talk at the latest conferences about TSMC customers taking wafers to Intel for packaging. The question is why? Is it competitive pricing? Capacity? Supply chain diversity? CC Wei was asked about this during the last investor call and his perfect response was: Jeff Su: I guess very simply put, EMIB-T, in his view, is… Read More The post TSMC CoWoS versus Intel EMIB Semiconductor Packaging appeared first on SemiWiki.
Source: https://semiwiki.com/semiconductor-manu ... packaging/