New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations StreamDQ: Near-Memory Weight DeQuantization in Custom HBM for Scalable AI Inference Acceleration SK hynix Open DRAM Model—Part II: Enabling Processing-in-Memory in 3-D DRAM Georgia Institute of Technology Evaluating Hardware Abstraction Layer Concepts for Software Defined Vehicles: Insights into Applicability and Effectiveness University of Stuttgart Self-Heating and Radiation Hardness Studies of 3nm GAA-FET-Based SRAM with Different Substrate Isolation Techniques San Jose State University, Sandia National Laboratories Monolithic Integration of Piezo-Optomechanical Photonics and CMOS Electronics MITRE, University of Colorado Boulder, Sandia National Laboratories, University of Arizona, MIT Design and Benchmarking of a Quantum Photonic Chip Rotonium, National University of Singapore, Inveriant, Politecnico di Milano, CNIT AI-Driven Thermal Mapping and Management in 3D Integrated Photonic Circuits University of Florida, ficonTEC Service, Colorado State University Find more semiconductor research papers here. The post Chip Industry Technical Paper Roundup: July 21 appeared first on Semiconductor Engineering.
Source: https://semiengineering.com/chip-indust ... p-july-21/