SE Chip Industry Technical Paper Roundup: Sept. 8
Posted: Tue Sep 08, 2026 7:01 am
New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations FLINT: Efficiently Leveraging High Bandwidth Flash for Capacity-Scalable LLM Inference Acceleration
Huawei, ETH Zürich, HUST A Process-Aware Hybrid Si/IGO Monolithic-3D 6T SRAM with BEOL Pass-Gates for the 2nm Node
Georgia Tech, Synopsys Architecting the Next Generation of Asynchronous, Distributed GPUs for the AI Era
Purdue University Hardware-Managed Heterogeneous High-Bandwidth Memory and Flash in LLM Inference Systems
University of Oxford Intrinsic polarization superjunctions in III-nitride heterostructures for efficient power electronics
EPFL Intracavity Laser Wavelength Tuning by a Programmable Forward-Only Silicon Photonics Interferometer Mesh
UiT, Stanford University The influence of implantation conditions on dopant activation in Al-implanted 4H-SiC: A MD study applying an Al potential fitted to DFT barriers
TU Wien, Silvaco Europe
Find more semiconductor research papers here. The post Chip Industry Technical Paper Roundup: Sept. 8 appeared first on Semiconductor Engineering.
Source: https://semiengineering.com/chip-indust ... -sept-8-2/
Huawei, ETH Zürich, HUST A Process-Aware Hybrid Si/IGO Monolithic-3D 6T SRAM with BEOL Pass-Gates for the 2nm Node
Georgia Tech, Synopsys Architecting the Next Generation of Asynchronous, Distributed GPUs for the AI Era
Purdue University Hardware-Managed Heterogeneous High-Bandwidth Memory and Flash in LLM Inference Systems
University of Oxford Intrinsic polarization superjunctions in III-nitride heterostructures for efficient power electronics
EPFL Intracavity Laser Wavelength Tuning by a Programmable Forward-Only Silicon Photonics Interferometer Mesh
UiT, Stanford University The influence of implantation conditions on dopant activation in Al-implanted 4H-SiC: A MD study applying an Al potential fitted to DFT barriers
TU Wien, Silvaco Europe
Find more semiconductor research papers here. The post Chip Industry Technical Paper Roundup: Sept. 8 appeared first on Semiconductor Engineering. Source: https://semiengineering.com/chip-indust ... -sept-8-2/