Plasma etch and deposition processing system maker Oxford Instruments Plasma Technology (OIPT) of Yatton, near Bristol, UK has unveiled a new alternative method of preparing silicon carbide (SiC) substrates for epitaxy. Plasma polishing for SiC substrates has been demonstrated as a superior and high-volume manufacturing (HVM)-compatible alternative to chemical-mechanical planarization (CMP), while alleviating significant technical, environmental and supply chain issues associated with CMP...
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