SCT OIPT launches alternative to CMP for epi-prep of silicon carbide substrates
Posted: Mon Aug 29, 2022 8:00 am
Plasma etch and deposition processing system maker Oxford Instruments Plasma Technology (OIPT) of Yatton, near Bristol, UK has unveiled a new alternative method of preparing silicon carbide (SiC) substrates for epitaxy. Plasma polishing for SiC substrates has been demonstrated as a superior and high-volume manufacturing (HVM)-compatible alternative to chemical-mechanical planarization (CMP), while alleviating significant technical, environmental and supply chain issues associated with CMP...
Source: https://semiconductor-today.com/news_it ... 0822.shtml
Source: https://semiconductor-today.com/news_it ... 0822.shtml